Jul 25, 2010
Convection and Flow Boiling in Microgaps and Porous Foam Coolers
Convection and Flow Boiling in Microgaps and Porous Foam Coolers is a good mechanical project for final year students and An open and foam-filled microgap cooler, providing direct liquid cooling for a simulated electronic/photonic component and which eliminates the problematic thermal resistance of the commonly-used thermal interface material (TIM), is examined. You can also Subscribe to FINAL YEAR PROJECT'S by Email for more such Projects and Seminar.
Author:- Kim, Dae Whan
Source:-University of Maryland
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