Thermal Modeling and Analysis of Three Dimensional (3D) Chip Stacks Mechanical Project

This is a good Mechanical project report on thermal modeling and analysis of three dimensional (3D) chip stacks. This thesis focuses on three relevant topics in the cooling of 3D chip stacks: 1) the determination of effective thermal properties for use in compact thermal models, 2) single phase internal liquid cooling, and 3) hot spot remediation with anisotropic thermal interface materials. You can also Subscribe to FINAL YEAR PROJECT'S by Email for more such Projects and Seminar.

Author:-Bachmann, Christopher
Source:- DRUM

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